A16A

A16 technology is TSMC's Angstrom-class logic node, integrating nanosheet transistors with Super Power Rail (SPR) for unprecedented HPC and AI performance.

A16 is the next-generation logic process from TSMC, slated for volume production in H2 2026. This Angstrom-class node introduces two critical innovations: nanosheet Gate-All-Around FETs (GAAFETs) and the Super Power Rail (SPR) architecture. SPR moves the power delivery network to the backside of the chip, decoupling it from signal routing. This design achieves up to a 1.10X chip density increase and delivers an 8-10% speed improvement (or a 15-20% power reduction) compared to the N2P process. We are targeting high-performance computing (HPC) and complex AI applications with this step-change in power efficiency and logic density.

https://www.tsmc.com/english/dedicatedFoundry/technology/A16